Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads

ABSTRACT

Light emitting devices include an active region of semiconductor material and a first contact on the active region. The first contact is configured such that photons emitted by the active region pass through the first contact. A photon absorbing wire bond pad is provided on the first contact. The wire bond pad has an area less than the area of the first contact. A reflective structure is disposed between the first contact and the wire bond pad such that the reflective structure has substantially the same area as the wire bond pad. A second contact is provided opposite the active region from the first contact. The reflective structure may be disposed only between the first contact and the wire bond pad. Methods of fabricating such devices are also provided.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of application Ser. No. 10/899,793,filed Jul. 27, 2004, entitled Light Emitting Devices Having a ReflectiveBond Pad and Methods of Fabricating Light Emitting Devices HavingReflective Bond Pads, assigned to the assignee of the presentapplication, the disclosure of which is hereby incorporated herein byreference in its entirety as if set forth fully herein.

FIELD OF THE INVENTION

This invention relates to semiconductor light emitting devices andmethods of fabricating light emitting devices.

BACKGROUND OF THE INVENTION

Semiconductor light emitting devices, such as Light Emitting Diodes(LEDs) or laser diodes, are widely used for many applications. As iswell known to those having skill in the art, a semiconductor lightemitting device includes a semiconductor light emitting element havingone or more semiconductor layers that are configured to emit coherentand/or incoherent light upon energization thereof. As is well known tothose having skill in the art, a light emitting diode or laser diode,generally includes a diode region on a microelectronic substrate. Themicroelectronic substrate may be, for example, gallium arsenide, galliumphosphide, alloys thereof, silicon carbide and/or sapphire. Continueddevelopments in LEDs have resulted in highly efficient and mechanicallyrobust light sources that can cover the visible spectrum and beyond.These attributes, coupled with the potentially long service life ofsolid state devices, may enable a variety of new display applications,and may place LEDs in a position to compete with the well entrenchedincandescent and fluorescent lamps.

Much development interest and commercial activity recently has focusedon LEDs that are fabricated in or on silicon carbide, because these LEDscan emit radiation in the blue/green portions of the visible spectrum.See, for example, U.S. Pat. No. 5,416,342 to Edmond et al., entitledBlue Light-Emitting Diode With High External Quantum Efficiency,assigned to the assignee of the present application, the disclosure ofwhich is hereby incorporated herein by reference in its entirety as ifset forth fully herein. There also has been much interest in LEDs thatinclude gallium nitride-based diode regions on silicon carbidesubstrates, because these devices also may emit light with highefficiency. See, for example, U.S. Pat. No. 6,177,688 to Linthicum etal., entitled Pendeoepitaxial Gallium Nitride Semiconductor Layers OnSilicon Carbide Substrates, the disclosure of which is herebyincorporated herein by reference in its entirety as if set forth fullyherein.

The efficiency of conventional LEDs may be limited by their inability toemit all of the light that is generated by their active region. When anLED is energized, light emitting from its active region (in alldirections) may be prevented from exiting the LED by, for example, alight absorbing wire bond pad. Typically, in gallium nitride based LEDs,a current spreading contact layer is provided to improve the uniformityof carrier injection across the cross section of the light emittingdevice. Current is injected into the p-side of the LED through the bondpad and the p-type contact. The p-type contact layer provides for asubstantially uniform injection of carriers into the active region.Thus, a substantially uniform photon emission across the active regionmay result from the use of a current spreading layer, such as asubstantially transparent p-type contact layer. However, a wire bond padis typically not a transparent structure and, therefore, photons emittedfrom the active region of the LED that are incident upon the wire bondpad may be absorbed by the wire bond pad. For example, in some instancesapproximately 70% of the light incident on the wire bond pad may beabsorbed. Such photon absorption may reduce the amount of light thatescapes from the LED and may decrease the efficiency of the LED.

SUMMARY OF THE INVENTION

Some embodiments of the present invention provide light emitting devicesand/or methods of fabricating light emitting devices including an activeregion of semiconductor material and a first contact on the activeregion. The first contact is configured such that photons emitted by theactive region pass through the first contact. A photon absorbing wirebond pad is provided on the first contact. The wire bond pad has an arealess than the area of the first contact. A reflective structure isdisposed between the first contact and the wire bond pad such that thereflective structure has less area than the first contact. A secondcontact is provided opposite the active region from the first contact.

In some embodiments, the reflective structure has substantially the samearea as the wire bond pad. For example, the reflective structure may becongruent with the wire bond pad. In some embodiments, the reflectivestructure does not extend beyond the wire bond pad.

In some embodiments of the present invention, a p-type semiconductormaterial is disposed between the first contact and the active region. Inother embodiments of the present invention, an n-type semiconductormaterial is disposed between the first contact and the active region.The active region may be a Group III-nitride based active region.

In particular embodiments of the present invention, the reflectivestructure includes a layer of reflective metal. The reflective structuremay be self-aligned with the wire bond pad. In some embodiments of thepresent invention, the reflective structure includes a roughened area ofthe first contact and the wire bond pad is directly on the firstcontact. The roughened area may be self-aligned with the wire bond pad.

In still further embodiments of the present invention, the reflectivestructure includes a roughened area of the first contact and areflective metal layer on the roughened area of the first contact.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustrating semiconductor lightemitting devices having a reflective bond pad structure according tosome embodiments of the present invention.

FIGS. 2A and 2B are cross-sectional views illustrating fabrication ofsemiconductor devices according to some embodiments of the presentinvention.

FIG. 3 is a cross-sectional view of light emitting devices according tofurther embodiments of the present invention.

DETAILED DESCRIPTION

The present invention now will be described more fully hereinafter withreference to the accompanying drawings, in which embodiments of theinvention are shown. However, this invention should not be construed aslimited to the embodiments set forth herein. Rather, these embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the scope of the invention to those skilled in theart. In the drawings, the thickness of layers and regions areexaggerated for clarity. Like numbers refer to like elements throughout.As used herein the term “and/or” includes any and all combinations ofone or more of the associated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present. Itwill also be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Like numbers refer to like elementsthroughout the specification.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother elements as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in the Figures is turned over, elements describedas being on the “lower” side of other elements would then be oriented on“upper” sides of the other elements. The exemplary term “lower”, cantherefore, encompasses both an orientation of “lower” and “upper,”depending of the particular orientation of the figure. Similarly, if thedevice in one of the figures is turned over, elements described as“below” or “beneath” other elements would then be oriented “above” theother elements. The exemplary terms “below” or “beneath” can, therefore,encompass both an orientation of above and below.

Embodiments of the present invention are described herein with referenceto cross-section illustrations that are schematic illustrations ofidealized embodiments of the present invention. As such, variations fromthe shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,embodiments of the present invention should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. For example, an etched region illustrated or described asa rectangle will, typically, have rounded or curved features. Thus, theregions illustrated in the figures are schematic in nature and theirshapes are not intended to illustrate the precise shape of a region of adevice and are not intended to limit the scope of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

It will also be appreciated by those of skill in the art that referencesto a structure or feature that is disposed “adjacent” another featuremay have portions that overlap or underlie the adjacent feature.

Although various embodiments of LEDs disclosed herein include asubstrate, it will be understood by those skilled in the art that thecrystalline epitaxial growth substrate on which the epitaxial layerscomprising an LED are grown may be removed, and the freestandingepitaxial layers may be mounted on a substitute carrier substrate orsubmount which may have better thermal, electrical, structural and/oroptical characteristics than the original substrate. The inventiondescribed herein is not limited to structures having crystallineepitaxial growth substrates and may be utilized in connection withstructures in which the epitaxial layers have been removed from theiroriginal growth substrates and bonded to substitute carrier substrates.

Some embodiments of the present invention may provide for improvedefficacy of a light emitting device by reducing and/or preventing photonabsorption by a wire bond pad. Thus, some embodiments of the presentinvention may provide light emitting devices and methods of fabricatinglight emitting devices having a reflective structure between the wirebond pad and an ohmic contact of the light emitting device. Byreflecting photons incident in the region of the wire bond pad, theamount of photons absorbed by the wire bond pad may be reduced. In someembodiments of the present invention, an increase in efficiency of thelight emitting device may be proportional to the size of the wire bondpad.

Embodiments of the present invention may be particularly well suited foruse in nitride-based light emitting devices such as Group III-nitridebased devices. As used herein, the term “Group III nitride” refers tothose semiconducting compounds formed between nitrogen and the elementsin Group III of the periodic table, usually aluminum (Al), gallium (Ga),and/or indium (In). The term also refers to ternary and quaternarycompounds such as AlGaN and AlInGaN. As is well understood by those inthis art, the Group III elements can combine with nitrogen to formbinary (e.g., GaN), ternary (e.g., AlGaN, AlInN), and quaternary (e.g.,AlInGaN) compounds. These compounds all have empirical formulas in whichone mole of nitrogen is combined with a total of one mole of the GroupIII elements. Accordingly, formulas such as Al_(x)Ga_(1-x)N where 0≦x≦1are often used to describe them. However, while embodiments of thepresent invention are described herein with reference to GroupIII-nitride based light emitting devices, such as gallium nitride basedlight emitting devices, certain embodiments of the present invention maybe suitable for use in other semiconductor light emitting devices, suchas for example, GaAs and/or GaP based devices.

Light emitting devices according to some embodiments of the presentinvention may include a light emitting diode, laser diode and/or othersemiconductor device which includes one or more semiconductor layers,which may include silicon, silicon carbide, gallium nitride and/or othersemiconductor materials, a substrate which may include sapphire,silicon, silicon carbide and/or other microelectronic substrates, andone or more contact layers which may include metal and/or otherconductive layers. In some embodiments, ultraviolet, blue and/or greenLEDs may be provided. The design and fabrication of semiconductor lightemitting devices are well known to those having skill in the art andneed not be described in detail herein.

For example, light emitting devices according to some embodiments of thepresent invention may include structures such as the galliumnitride-based LED and/or laser structures fabricated on a siliconcarbide substrate such as those devices manufactured and sold by Cree,Inc. of Durham, N.C. The present invention may be suitable for use withLED and/or laser structures that provide active regions such asdescribed in U.S. Pat. Nos. 6,201,262; 6,187,606; 6,120,600; 5,912,477;5,739,554; 5,631,190; 5,604,135; 5,523,589; 5,416,342; 5,393,993;5,338,944; 5,210,051; 5,027,168; 5,027,168; 4,966,862 and/or 4,918,497,the disclosures of which are incorporated herein by reference as if setforth fully herein. Other suitable LED and/or laser structures aredescribed in published U.S. Patent Publication No. US 2003/0006418 A1entitled Group III Nitride Based Light Emitting Diode Structures With aQuantum Well and Superlattice, Group III Nitride Based Quantum WellStructures and Group III Nitride Based Superlattice Structures,published Jan. 9, 2003, U.S. patent application Ser. No. 10/899,791,entitled “GROUP III NITRIDE BASED QUANTUM WELL LIGHT EMITTING DEVICESTRUCTURES WITH AN INDIUM CONTAINING CAPPING STRUCTURE” filed Jul. 27,2004, as well as published U.S. Patent Publication No. US 2002/0123164A1 entitled Light Emitting Diodes Including Modifications for LightExtraction and Manufacturing Methods Therefor. Furthermore, phosphorcoated LEDs, such as those described in U.S. application Ser. No.10/659,241, entitled Phosphor-Coated Light Emitting Diodes IncludingTapered Sidewalls and Fabrication Methods Therefor, filed Sep. 9, 2003,the disclosure of which is incorporated by reference herein as if setforth fully, may also be suitable for use in embodiments of the presentinvention. The LEDs and/or lasers may be configured to operate such thatlight emission occurs through the substrate. In such embodiments, thesubstrate may be patterned so as to enhance light output of the devicesas is described, for example, in the above-cited U.S. Patent PublicationNo. US 2002/0123164 A1. These structures may be modified as describedherein to provide reflective structures according to some embodiments ofthe present invention.

Thus, for example, embodiments of the present invention may be utilizedwith light emitting devices having bond pads of differing shapes orsizes. The light emitting devices may be on differing substrates, suchas silicon carbide, sapphire, gallium nitride, silicon or othersubstrate suitable substrate for providing Group III-nitride devices.The light emitting devices may be suitable for subsequent singulationand mounting on a suitable carrier. The light emitting devices mayinclude, for example, single quantum well, multi-quantum well and/orbulk active region devices. Some embodiments of the present inventionmay be used with devices utilizing a tunneling contact on the p-side ofthe device.

FIG. 1 is a cross-sectional schematic illustration of a light emittingdevice according to some embodiments of the present invention. As seenin FIG. 1, a substrate 10, such as an n-type silicon carbide substrate,has an optional n-type semiconductor layer 12, such as a gallium nitridebased layer, provided thereon. The n-type semiconductor layer 12 mayinclude multiple layers, for example, buffer layers or the like. In someembodiments of the present invention, the n-type semiconductor layer 12is provided as a silicon doped AlGaN layer, that may be of uniform orgradient composition, and a silicon doped GaN layer.

While described herein with reference to a silicon carbide substrate, insome embodiments of the present invention other substrate materials maybe utilized. For example, a sapphire substrate, GaN or other substratematerial may be utilized. In such a case, the contact 20 may be located,for example, in a recess that contacts the n-type semiconductor layer12, so as to provide a second contact for the device. Otherconfigurations may also be utilized.

An active region 14, such as a single or double heterostructure, quantumwell, multi-quantum well or other such active region may be provided onthe n-type semiconductor layer. As used herein, the term “active region”refers to a region of semiconductor material of a light emitting device,that may be one or more layers and/or portions thereof, where asubstantial portion of the photons emitted by the device when inoperation are generated by carrier recombination. In some embodiments ofthe present invention, the active region refers to a region wheresubstantially all of the photons emitted by the device are generated bycarrier recombination.

Also illustrated in FIG. 1 is an optional p-type semiconductor layer 16.The p-type semiconductor material layer 16 may, for example, be agallium nitride based layer, such as a GaN layer. In particularembodiments of the present invention, the p-type semiconductor layer 16includes magnesium doped GaN. The p-type semiconductor layer 16 mayinclude one or multiple layers and may be of uniform or gradientcomposition. In some embodiments of the present invention, the p-typesemiconductor layer 16 is part of the active region 14.

A first contact metal layer 18 of contact metal that provides an ohmiccontact to the p-type semiconductor material layer 16 is also provided.In some embodiments, the first contact metal layer 18 may function as acurrent spreading layer. In particular embodiments of the presentinvention where the p-type semiconductor material layer 16 is GaN, thefirst contact metal layer 18 may be Pt. In certain embodiments of thepresent invention, the first contact metal layer 18 is light permeableand in some embodiments is substantially transparent such that photonsemitted by the active region 14 may pass through the first contact metallayer 18. In some embodiments, the first contact metal layer 18 may be arelatively thin layer of Pt. For example, the first contact metal layer18 may be a layer of Pt that is about 54 Å thick. A wire bond pad 22 orother light absorbing region is provided on the first contact metallayer 18. In some embodiments of the present invention, the firstcontact metal layer 18 is provided as a very thin layer having athickness of less than about 10 Å as described in U.S. ProvisionalPatent Application Ser. No. 60/591,353, entitled “ULTRA-THIN OHMICCONTACTS FOR P-TYPE NITRIDE LIGHT EMITTING DEVICES”, filed Jul. 27,2004, the disclosure of which is incorporated herein as if set forth inits entirety.

A second contact metal layer 20 of contact metal that provides an ohmiccontact to the n-type semiconductor material is also provided. Thesecond contact metal layer 20 may be provided on a side of the substrate10 opposite the active region 14. The second contact metal layer 20 mayalso be provided on a same side of the substrate 10 as the active region14. As discussed above, in some embodiments of the present invention thesecond contact metal layer 20 may be provided on a portion of the n-typesemiconductor material layer 12, for example, in a recess or at a baseof a mesa including the active region. Furthermore, in some embodimentsof the present invention, an optional back-side implant or additionalepitaxial layers may be provide between the substrate 10 and the secondcontact metal layer 20.

As is further illustrated in FIG. 1, a reflective structure is providedby a reflective metal layer 30 disposed between the wire bond pad 22 andthe first metal contact layer 18. The reflective metal layer 30 hassubstantially the same shape and/or area as the area of the wire bondpad 22 on the first contact metal layer 18. In some embodiments of thepresent invention, the reflective metal layer 30 has a slightly largerarea than the wire bond pad 22 while in other embodiments of the presentinvention, the reflective metal layer 30 has a slightly smaller areathan the wire bond pad 22. Such variations may, for example, be theresult of manufacturing tolerances or variations resulting from thefabrication sequence, alignment tolerances or the like. In certainembodiments, the reflective metal layer 30 may also have exactly thesame area as the wire bond pad 22. The reflective metal layer 30 may bea layer of silver (Ag), aluminum (Al) or other reflective conductingmetal.

By providing a reflective structure between the photon absorbing wirebond pad and the active region the amount of photons absorbed by thewire bond pad may be reduced. Furthermore, by the reflective structurebeing substantially the same area as the wire bond pad, photon emissionthrough the p-contact metal layer may still be provided. Accordingly,the overall light extraction from the device may be increased.

FIGS. 2A and 2B illustrate operations according to some embodiments ofthe present invention for forming light emitting devices having areflective structure as illustrated in FIG. 1. As seen in FIG. 2A, thevarious layers/regions of the light emitting device are fabricated. Theparticular operations in the fabrication of the light emitting devicewill depend on the structure to be fabricated and are described in theUnited States patents and/or applications incorporated by referenceherein and/or are well known to those of skill in the art and,therefore, need not be repeated herein. FIG. 2A also illustratesformation of a mask 40 having a window 42 that exposes a portion of thefirst contact layer 18 corresponding to the region where the wire bondpad 22 is to be formed.

A reflective layer 30 is deposited using the mask 40 so as to besubstantially aligned with the region of the wire bond pad 22 as seen inFIG. 2B. Techniques for the deposition of reflective conductive metalsare known to those of skill in the art and need not be described furtherherein. After formation of the reflective layer 30, the wire bond pad 22may be formed in the window 42. Thus, in some embodiments of the presentinvention, the wire bond pad 22 and the reflective layer 30 may beself-aligned. The wire bond pad 22 may be formed, for example, byforming a layer or layers of the metal from which the wire bond pad 22is formed and then planarizing the layers to provide the wire bond pad22. The mask 40 may subsequently be removed. Optionally, the mask 40 maybe made of an insulating material, such as SiO₂ and/or AlN, and mayremain on the device as, for example, a passivation layer, or beremoved. Alternatively, layers of reflective metal and/or bond pad metalcould be blanket deposited and then etched to provide the reflectivelayer 30 and the wire bond pad 22.

FIG. 3 illustrates light emitting devices according to furtherembodiments of the present invention. In FIG. 3, the first contact metallayer 18 includes a first portion 55 outside the area of the wire bondpad 22 and a second portion 57 in the area of the wire bond pad 22. Thesecond portion 57 includes a roughened area 50 where the surface of thefirst contact metal layer 18 provides greater internal reflection ofphotons incident upon the surface than is provided by the surface of thefirst portion 55 of the first contact metal layer 18. For example, theroughened area 50 may include angled surfaces from which the photons arereflected rather than pass through. The roughened area 50 may have thesame shape and/or area as the area of the wire bond pad 22 on the firstcontact metal layer 18. In some embodiments of the present invention,the roughened area 50 has a slightly larger area than the wire bond pad22 while in other embodiments of the present invention, the roughenedarea 50 has a slightly smaller area than the wire bond pad 22. Inparticular embodiments of the present invention, the roughened area hasexactly the same shape and area as the wire bond pad 22.

The roughened area 50 may be provided by, for example, etching the areawhere the wire bond pad 22 is formed. Such an etch may utilize the mask40 illustrated in FIG. 2A which may be provided prior to formation ofthe wire bond pad 22. Other techniques for roughening the interface mayalso be utilized.

By providing a roughened area beneath the wire bond pad, angled surfacesmay be provided as a reflective structure that increases the internalreflection of light back into the contact layer. Thus, the amount oflight absorbed by the wire bond pad may be reduced.

While embodiments of the present invention are illustrated in FIGS. 1through 3 with reference to particular light emitting device structures,other structures may be provided according to some embodiments of thepresent invention. Thus, embodiments of the present invention may beprovided by any light emitting structure that includes one or more ofthe various reflective structures as described above. For example, wirebond pad reflective structures according to some embodiments of thepresent invention may be provided in conjunction with the exemplarylight emitting device structures discussed in the United States patentsand/or applications incorporated by reference herein.

Embodiments of the present invention have been described with referenceto a wire bond pad 22. As used herein, the term bond pad refers to alight absorbing contact structure to which a wire is subsequentlybonded. A bond pad may be a single or multiple layers, may be a metaland/or metal alloy and/or may be of uniform of non-uniform composition.

Embodiments of the present invention have been described with referenceto the wire bond pad being provided on the contact to the p-typesemiconductor material, however, the wire bond pad could, alternatively,be provided to the n-type semiconductor material, such as the substrate10. In such a case, the reflective structures described above could bedisposed between the second contact metal layer 20 and a wire bond padon that layer. Furthermore, any suitable contact metal and/or reflectivemetal may be utilized for the first and second contact metal layers 18and 20 and the reflective layer 30. For example, metal and reflectivelayers as well as stacks of layers may be provided as described inUnited States Patent Publication No. US 2002/0123164 A1, published Sep.5, 2002 and entitled “Light Emitting Diodes Including Modifications ForLight Extraction and Manufacturing Methods Therefore” and/or UnitedStates Patent Publication No. US 2003/0168663 A1, published Sep. 11,2003 and entitled “Reflective Ohmic Contacts For Silicon CarbideIncluding a Layer Consisting Essentially of Nickel, Methods ofFabricating Same, and Light Emitting Devices Including the Same,” thedisclosures of which are incorporated herein as if set forth fullyherein.

Furthermore, while embodiments of the present invention have beendescribed with reference to a particular sequence of operations,variations from the described sequence may be provided while stillbenefiting from the teachings of the present invention. Thus, two ormore steps may be combined into a single step or steps performed out ofthe sequence described herein. Thus, embodiments of the presentinvention should not be construed as limited to the particular sequenceof operations described herein unless stated otherwise herein.

It will be understood by those having skill in the art that variousembodiments of the invention have been described individually inconnection with FIGS. 1-3. However, combinations and subcombinations ofthe embodiments of FIGS. 1-3 may be provided according to variousembodiments of the present invention. For example, the structures ofFIGS. 1 and 3 may be combined by providing the reflective layer 30 onthe roughened area 50.

In the drawings and specification, there have been disclosed embodimentsof the invention and, although specific terms are employed, they areused in a generic and descriptive sense only and not for purposes oflimitation, the scope of the invention being set forth in the followingclaims.

1. A light emitting device, comprising: an active region comprisingsemiconductor material; a first contact on the active region; a photonabsorbing wire bond pad on the first contact, the wire bond pad havingan area less than the area of the first contact; a reflective structuredisposed between the first contact and the wire bond pad and having anarea that is less than the area of the first contact; and a secondcontact opposite the active region from the first contact; wherein thereflective structure comprises: a roughened area of the first contact;and a reflective metal layer on the roughened area of the first contact.2. A light emitting device, comprising: an active region comprisingsemiconductor material; a first contact on the active region; a photonabsorbing wire bond pad on the first contact, the wire bond pad havingan area less than the area of the first contact; a reflective structuredisposed between the first contact and the wire bond pad and having anarea that is less than the area of the first contact; and a secondcontact opposite the active region from the first contact; wherein thereflective structure comprises a roughened area of the first contact andwherein the wire bond pad is directly on the first contact; and whereinthe reflective structure does not extend beyond the wire bond pad. 3.The light emitting device of claim 2 further comprising a p-typesemiconductor material disposed between the first contact and the activeregion.
 4. The light emitting device of claim 2, further comprising ann-type semiconductor material between the first contact and the activeregion.
 5. The light emitting device of claim 2, wherein the activeregion comprises a Group III-nitride based active region.
 6. The lightemitting device of claim 2 wherein the reflective structure comprises alayer of reflective metal.
 7. The light emitting device of claim 2,wherein the reflective structure is self-aligned with the wire bond pad.8. The light emitting device of claim 2, wherein the roughened area isself-aligned with the wire bond pad.
 9. The light emitting device ofclaim 2, wherein the reflective structure has substantially the samearea as the wire bond pad.
 10. The light emitting device of claim 2,wherein the reflective structure is substantially congruent with thewire bond pad.
 11. A method of fabricating a light emitting device,comprising: forming an active region of semiconductor material; forminga first contact on the active region; forming a reflective structure onthe first contact and having an area less than an area of the firstcontact forming a photon absorbing wire bond pad on reflectivestructure, the wire bond pad having an area less than the area of thefirst contact; and forming a second contact opposite the active regionfrom the first contact; wherein forming a reflective structure comprisesroughening an area of the first contact; and wherein forming areflective structure and forming a wire bond pad comprises: forming amask layer on the first contact, the mask layer having an opening thatexposes a portion of the first contact corresponding to the location ofthe wire bond pad on the first contact; depositing a reflective metallayer in the opening of the mask layer; and forming the wire bond pad onthe reflective metal layer in the opening of the mask layer.
 12. Amethod of fabricating a light emitting device, comprising: forming anactive region of semiconductor material; forming a first contact on theactive region; forming a reflective structure on the first contact andhaving an area less than an area of the first contact forming a photonabsorbing wire bond pad on reflective structure, the wire bond padhaving an area less than the area of the first contact; and forming asecond contact opposite the active region from the first contact;wherein forming a reflective structure comprises roughening an area ofthe first contact and wherein forming a wire bond pad comprises forminga wire bond pad directly on the first contact; and wherein roughening anarea of the first contact and forming a wire bond pad comprises: forminga mask layer on the first contact, the mask layer having an opening thatexposes a portion of the first contact corresponding to the location ofthe wire bond pad on the first contact; roughening the portion of thefirst contact exposed by the opening of the mask layer; and forming thewire bond pad on the roughened portion of the first contact in theopening of the mask layer.
 13. A method of fabricating a light emittingdevice, comprising: forming an active region of semiconductor material;forming a first contact on the active region; forming a reflectivestructure on the first contact and having an area less than an area ofthe first contact forming a photon absorbing wire bond pad on reflectivestructure, the wire bond pad having an area less than the area of thefirst contact; and forming a second contact opposite the active regionfrom the first contact; wherein forming a reflective structurecomprises: forming a roughened area of the first contact; and forming areflective metal layer on the roughened area of the first contact. 14.The method of claim 13, further comprising forming a p-typesemiconductor material disposed between the first contact and the activeregion.
 15. The method of claim 13, further comprising forming an n-typesemiconductor material between the first contact and the active region.16. The method of claim 13, wherein forming an active region comprisesforming a Group III-nitride based active region.
 17. The method of claim13, wherein the reflective structure does not extend beyond the wirebond pad.
 18. The method of claim 13, wherein the reflective structurehas substantially the same area as the wire bond pad.
 19. The method ofclaim 13, wherein the reflective structure is substantially congruentwith the wire bond pad.